SVF311R3K1CKU2 vs SVF311R3K2CKU2

This detailed comparison of SVF311R3K1CKU2 and SVF311R3K2CKU2 in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

SVF311R3K1CKU2

SVF311R3K1CKU2

NXP Semiconductors

SVF311R3K2CKU2

SVF311R3K2CKU2

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 176-LQFP Exposed Pad 176-LQFP Exposed Pad
Description IC MCU 32BIT ROMLESS 176LQFP IC MCU 32BIT ROMLESS 176LQFP
In Stock 2 597 40
Mounting Type - -
Part Status Active Active
Series Vybrid, VF3xxR Vybrid, VF3xxR
Package Bulk Tray
Core Processor ARM® Cortex®-A5 ARM® Cortex®-A5
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 266MHz 266MHz
Co-Processors/DSP Multimedia; NEON™ MPE Multimedia; NEON™ MPE
RAM Controllers LPDDR2, DDR3, DRAM LPDDR2, DDR3, DRAM
Graphics Acceleration No No
Display & Interface Controllers DCU, GPU, LCD, VideoADC, VIU DCU, GPU, LCD, VideoADC, VIU
Ethernet 10/100Mbps (2) 10/100Mbps (2)
SATA - -
USB USB 2.0 OTG + PHY (1) USB 2.0 OTG + PHY (1)
Voltage - I/O 3.3V 3.3V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Security Features ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Supplier Device Package 176-LQFP-EP (24x24) 176-LQFP-EP (24x24)
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