SVF311R3K1CKU2 vs MVF30NS152CKU26

This detailed comparison of SVF311R3K1CKU2 and MVF30NS152CKU26 in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

SVF311R3K1CKU2

NXP Semiconductors

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MVF30NS152CKU26

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	176-LQFP Exposed Pad	176-LQFP Exposed Pad
Description	IC MCU 32BIT ROMLESS 176LQFP	IC MCU 32BIT ROMLESS 176LQFP
In Stock	2 597	790
Mounting Type	-	-
Part Status	Active	Active
Series	Vybrid, VF3xxR	Vybrid, VF3xx
Package	Bulk	Tray
Core Processor	ARM® Cortex®-A5	ARM® Cortex®-A5
Number of Cores/Bus Width	1 Core, 32-Bit	1 Core, 32-Bit
Speed	266MHz	266MHz
Co-Processors/DSP	Multimedia; NEON™ MPE	Multimedia; NEON™ MPE
RAM Controllers	LPDDR2, DDR3, DRAM	LPDDR2, DDR3, DRAM
Graphics Acceleration	No	Yes
Display & Interface Controllers	DCU, GPU, LCD, VideoADC, VIU	DCU, GPU, LCD, VideoADC, VIU
Ethernet	10/100Mbps (2)	10/100Mbps (2)
SATA	-	-
USB	USB 2.0 OTG + PHY (1)	USB 2.0 OTG + PHY (1)
Voltage - I/O	3.3V	3.3V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Security Features	ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG	ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Supplier Device Package	176-LQFP-EP (24x24)	176-LQFP-EP (24x24)