TC74HC4052APF vs ADG5434BCPZ-REEL7

This detailed comparison of TC74HC4052APF and ADG5434BCPZ-REEL7 in the Interface - Analog Switches, Multiplexers, Demultiplexers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

TC74HC4052APF

TC74HC4052APF

Toshiba Electronic Devices and Storage Corporation

ADG5434BCPZ-REEL7

ADG5434BCPZ-REEL7

Linear Technology (Analog Devices, Inc.)

Specifications
Manufacturer Toshiba Electronic Devices and Storage Corporation Linear Technology (Analog Devices, Inc.)
Package / Case 16-DIP (0.300", 7.62mm) 20-WFQFN Exposed Pad, CSP
Description IC MUX/DEMUX DUAL 4X1 16DIP IC SW ANLG QUAD SPDT 20LFCSP
In Stock 279 6 578
Mounting Type Through Hole Surface Mount
Part Status Active Active
Series - -
Package Tube Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Switch Circuit SP4T SPDT
Multiplexer/Demultiplexer Circuit 4:1 2:1
Number of Circuits 2 4
On-State Resistance (Max) 100Ohm 14Ohm
Channel-to-Channel Matching (ΔRon) 5Ohm 300mOhm
Voltage - Supply, Single (V+) 2V ~ 6V 9V ~ 40V
Voltage - Supply, Dual (V±) ±2V ~ 6V ±9V ~ 22V
Switch Time (Ton, Toff) (Max) 18ns, 29ns (Typ) 186ns, 104ns
-3db Bandwidth 140MHz 140MHz
Charge Injection - 176pC
Channel Capacitance (CS(off), CD(off)) 2pF, 40pF 15pF, 23pF
Current - Leakage (IS(off)) (Max) 100nA 250pA
Crosstalk -50dB @ 1MHz -60dB @ 1MHz
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 16-DIP 20-LFCSP-WQ (4x4)
Top