TMS5703137CGWTQEP vs TMS5703137CGWTMEP

This detailed comparison of TMS5703137CGWTQEP and TMS5703137CGWTMEP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

TMS5703137CGWTQEP

TMS5703137CGWTQEP

Texas Instruments

TMS5703137CGWTMEP

TMS5703137CGWTMEP

Texas Instruments

Specifications
Manufacturer Texas Instruments Texas Instruments
Package / Case 337-LFBGA 337-LFBGA
Description IC MCU 16/32B 3MB FLASH 337NFBGA IC MCU 16/32B 3MB FLASH 337NFBGA
In Stock 126 90
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series Hercules™ TMS570 ARM® Cortex®-R Hercules™ TMS570 ARM® Cortex®-R
Package Tube Tray
Core Processor ARM® Cortex®-R4F ARM® Cortex®-R4F
Core Size 16/32-Bit 16/32-Bit
Speed 180MHz 180MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 120 120
Program Memory Size 3MB (3M x 8) 3MB (3M x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 256K x 8 256K x 8
Voltage - Supply (Vcc/Vdd) 1.14V ~ 1.32V 1.14V ~ 1.32V
Data Converters A/D 16x12b, 24x12b A/D 16x12b, 24x12b
Oscillator Type External External
Operating Temperature -40°C ~ 125°C (TA) -55°C ~ 125°C (TA)
Supplier Device Package 337-NFBGA (16x16) 337-NFBGA (16x16)
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