UPD70F3762GC-UEU-AX vs UPD70F3763GC-UEU-AX

This detailed comparison of UPD70F3762GC-UEU-AX and UPD70F3763GC-UEU-AX in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD70F3762GC-UEU-AX

UPD70F3762GC-UEU-AX

Renesas Electronics America

UPD70F3763GC-UEU-AX

UPD70F3763GC-UEU-AX

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 100-LQFP 100-LQFP
Description IC MCU 32BIT 512KB FLASH 100LQFP IC MCU 32BIT 384KB FLASH 100LQFP
In Stock 66 2 254
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series V850ES/Jx3-H V850ES/Jx3-U
Package Tray Tray
Core Processor V850ES V850ES
Core Size 32-Bit 32-Bit
Speed 48MHz 48MHz
Connectivity CSI, EBI/EMI, I²C, UART/USART, USB CSI, EBI/EMI, I²C, UART/USART, USB
Peripherals DMA, LVD, PWM, WDT DMA, LVD, PWM, WDT
Number of I/O 77 75
Program Memory Size 512KB (512K x 8) 384KB (384K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 56K x 8 48K x 8
Voltage - Supply (Vcc/Vdd) 2.85V ~ 3.6V 2.85V ~ 3.6V
Data Converters A/D 12x10b; D/A 2x8b A/D 12x10b; D/A 2x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package - -
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