UPD70F3821GB-GAH-AX vs UPD70F3823GB-GAH-AX

This detailed comparison of UPD70F3821GB-GAH-AX and UPD70F3823GB-GAH-AX in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD70F3821GB-GAH-AX

UPD70F3821GB-GAH-AX

Renesas Electronics America

UPD70F3823GB-GAH-AX

UPD70F3823GB-GAH-AX

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 64-LQFP 64-LQFP
Description IC MCU 32BIT 32KB FLASH 64LQFP IC MCU 32BIT 128KB FLASH 64LQFP
In Stock 1 794 7 250
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Not For New Designs
Series V850ES/Jx3-H V850ES/Jx3-H
Package Tray Tray
Core Processor V850ES V850ES
Core Size 32-Bit 32-Bit
Speed 48MHz 48MHz
Connectivity CANbus, CSI, EBI/EMI, I²C, UART/USART, USB CANbus, CSI, EBI/EMI, I²C, UART/USART, USB
Peripherals DMA, LVD, PWM, WDT DMA, LVD, PWM, WDT
Number of I/O 45 45
Program Memory Size 32KB (32K x 8) 128KB (128K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 16K x 8 24K x 8
Voltage - Supply (Vcc/Vdd) 2.85V ~ 3.6V 2.85V ~ 3.6V
Data Converters A/D 10x10b; D/A 1x8b A/D 10x10b; D/A 1x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package - -
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