UPD78F1155AGC-GAD-AX vs UPD78F1154AGK-GAK-AX

This detailed comparison of UPD78F1155AGC-GAD-AX and UPD78F1154AGK-GAK-AX in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD78F1155AGC-GAD-AX

UPD78F1155AGC-GAD-AX

Renesas Electronics America

UPD78F1154AGK-GAK-AX

UPD78F1154AGK-GAK-AX

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 80-LQFP 80-LQFP
Description IC MCU 16BIT 192KB FLASH 80LQFP IC MCU 16BIT 128KB FLASH 80LQFP
In Stock 2 444 351
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series 78K0R/Kx3 78K0R/Kx3
Package Tray Tray
Core Processor 78K/0R 78K/0R
Core Size 16-Bit 16-Bit
Speed 20MHz 20MHz
Connectivity 3-Wire SIO, I²C, LINbus, UART/USART 3-Wire SIO, I²C, LINbus, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 65 65
Program Memory Size 192KB (192K x 8) 128KB (128K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 10K x 8 8K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V 1.8V ~ 5.5V
Data Converters A/D 8x10b; D/A 2x8b A/D 8x10b; D/A 2x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package - -
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