W25Q256FVBIG TR vs W25Q256FVCIP

This detailed comparison of W25Q256FVBIG TR and W25Q256FVCIP in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

W25Q256FVBIG TR

Winbond Electronics Corporation

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W25Q256FVCIP

Winbond Electronics Corporation

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Specifications Hide identical items

Manufacturer	Winbond Electronics Corporation	Winbond Electronics Corporation
Package / Case	24-TBGA	24-TBGA
Description	IC FLSH 256MBIT SPI/QUAD 24TFBGA	IC FLSH 256MBIT SPI/QUAD 24TFBGA
In Stock	2 000	3 280
Mounting Type	Surface Mount	Surface Mount
Part Status	Discontinued at Digi-Key	Discontinued at Digi-Key
Series	SpiFlash®	SpiFlash®
Package	Tape & Reel (TR)	Tube
Memory Type	Non-Volatile	Non-Volatile
Memory Format	FLASH	FLASH
Technology	FLASH - NOR	FLASH - NOR
Memory Size	256Mb (32M x 8)	256Mb (32M x 8)
Memory Interface	SPI - Quad I/O, QPI	SPI - Quad I/O, QPI
Clock Frequency	104 MHz	104 MHz
Write Cycle Time - Word, Page	50µs, 3ms	50µs, 3ms
Access Time	-	-
Voltage - Supply	2.7V ~ 3.6V	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	24-TFBGA (6x8)	24-TFBGA (6x8)