W25Q256FVCIG TR vs W25Q32FVTCIG TR

This detailed comparison of W25Q256FVCIG TR and W25Q32FVTCIG TR in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

W25Q256FVCIG TR

Winbond Electronics Corporation

W25Q32FVTCIG TR

Winbond Electronics Corporation

Specifications Hide identical items

Manufacturer	Winbond Electronics Corporation	Winbond Electronics Corporation
Package / Case	24-TBGA	24-TBGA
Description	IC FLSH 256MBIT SPI/QUAD 24TFBGA	IC FLASH 32MBIT SPI/QUAD 24TFBGA
In Stock	8 507	5 000
Mounting Type	Surface Mount	Surface Mount
Part Status	Discontinued at Digi-Key	Obsolete
Series	SpiFlash®	SpiFlash®
Package	Tape & Reel (TR)	Tape & Reel (TR)
Memory Type	Non-Volatile	Non-Volatile
Memory Format	FLASH	FLASH
Technology	FLASH - NOR	FLASH - NOR
Memory Size	256Mb (32M x 8)	32Mb (4M x 8)
Memory Interface	SPI - Quad I/O, QPI	SPI - Quad I/O, QPI
Clock Frequency	104 MHz	104 MHz
Write Cycle Time - Word, Page	50µs, 3ms	50µs, 3ms
Access Time	-	-
Voltage - Supply	2.7V ~ 3.6V	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	24-TFBGA (6x8)	24-TFBGA (6x8)

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