W25Q32FVDAIG TR vs W25Q32FVDAIQ

This detailed comparison of W25Q32FVDAIG TR and W25Q32FVDAIQ in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

W25Q32FVDAIG TR

Winbond Electronics Corporation

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W25Q32FVDAIQ

Winbond Electronics Corporation

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Specifications Hide identical items

Manufacturer	Winbond Electronics Corporation	Winbond Electronics Corporation
Package / Case	8-DIP (0.300", 7.62mm)	8-DIP (0.300", 7.62mm)
Description	IC FLASH 32MBIT SPI/QUAD 8DIP	IC FLASH 32MBIT SPI/QUAD 8DIP
In Stock	3 620	5 000
Mounting Type	Through Hole	Through Hole
Part Status	Obsolete	Obsolete
Series	SpiFlash®	SpiFlash®
Package	Tape & Reel (TR)	Tube
Memory Type	Non-Volatile	Non-Volatile
Memory Format	FLASH	FLASH
Technology	FLASH - NOR	FLASH - NOR
Memory Size	32Mb (4M x 8)	32Mb (4M x 8)
Memory Interface	SPI - Quad I/O, QPI	SPI - Quad I/O, QPI
Clock Frequency	104 MHz	104 MHz
Write Cycle Time - Word, Page	50µs, 3ms	50µs, 3ms
Access Time	-	-
Voltage - Supply	2.7V ~ 3.6V	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	8-PDIP	8-PDIP