W25Q64FVXGJQ vs W25Q64FVXGJQ TR

This detailed comparison of W25Q64FVXGJQ and W25Q64FVXGJQ TR in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

W25Q64FVXGJQ

Winbond Electronics Corporation

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W25Q64FVXGJQ TR

Winbond Electronics Corporation

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Specifications Hide identical items

Manufacturer	Winbond Electronics Corporation	Winbond Electronics Corporation
Package / Case	8-XDFN Exposed Pad	8-XDFN Exposed Pad
Description	IC FLASH 64MBIT SPI/QUAD 8XSON	IC FLASH 64MBIT SPI/QUAD 8XSON
In Stock	1 418	4 320
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	SpiFlash®	SpiFlash®
Package	Tube	Tape & Reel (TR)
Memory Type	Non-Volatile	Non-Volatile
Memory Format	FLASH	FLASH
Technology	FLASH - NOR	FLASH - NOR
Memory Size	64Mb (8M x 8)	64Mb (8M x 8)
Memory Interface	SPI - Quad I/O, QPI	SPI - Quad I/O, QPI
Clock Frequency	104 MHz	104 MHz
Write Cycle Time - Word, Page	50µs, 3ms	50µs, 3ms
Access Time	-	-
Voltage - Supply	2.7V ~ 3.6V	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	8-XSON (4x4)	8-XSON (4x4)