W25Q32FWXGIG TR vs W25Q64FWXGIG TR

This detailed comparison of W25Q32FWXGIG TR and W25Q64FWXGIG TR in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

W25Q32FWXGIG TR

Winbond Electronics Corporation

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W25Q64FWXGIG TR

Winbond Electronics Corporation

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Specifications Hide identical items

Manufacturer	Winbond Electronics Corporation	Winbond Electronics Corporation
Package / Case	8-XDFN Exposed Pad	8-XDFN Exposed Pad
Description	IC FLASH 32MBIT SPI/QUAD 8XSON	IC FLASH 64MBIT SPI/QUAD 8XSON
In Stock	8 000	2 500
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	SpiFlash®	SpiFlash®
Package	Tape & Reel (TR)	Tape & Reel (TR)
Memory Type	Non-Volatile	Non-Volatile
Memory Format	FLASH	FLASH
Technology	FLASH - NOR	FLASH - NOR
Memory Size	32Mb (4M x 8)	64Mb (8M x 8)
Memory Interface	SPI - Quad I/O, QPI	SPI - Quad I/O, QPI
Clock Frequency	104 MHz	104 MHz
Write Cycle Time - Word, Page	60µs, 5ms	60µs, 5ms
Access Time	-	-
Voltage - Supply	1.65V ~ 1.95V	1.65V ~ 1.95V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	8-XSON (4x4)	8-XSON (4x4)