W978H6KBVX2E vs W978H6KBVX2I

This detailed comparison of W978H6KBVX2E and W978H6KBVX2I in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

W978H6KBVX2E

Winbond Electronics Corporation

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W978H6KBVX2I

Winbond Electronics Corporation

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Specifications Hide identical items

Manufacturer	Winbond Electronics Corporation	Winbond Electronics Corporation
Package / Case	134-VFBGA	134-VFBGA
Description	IC DRAM 256MBIT PAR 134VFBGA	IC DRAM 256MBIT PAR 134VFBGA
In Stock	2 058	9 864
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	-	-
Package	Tray	Tray
Memory Type	Volatile	Volatile
Memory Format	DRAM	DRAM
Technology	SDRAM - Mobile LPDDR2	SDRAM - Mobile LPDDR2
Memory Size	256Mb (16M x 16)	256Mb (16M x 16)
Memory Interface	Parallel	Parallel
Clock Frequency	400 MHz	400 MHz
Write Cycle Time - Word, Page	15ns	15ns
Access Time	-	-
Voltage - Supply	1.14V ~ 1.95V	1.14V ~ 1.95V
Operating Temperature	-25°C ~ 85°C (TC)	-40°C ~ 85°C (TA)
Supplier Device Package	134-VFBGA (10x11.5)	134-VFBGA (10x11.5)