XC2764X40F80LRABKXUMA1 vs XC2364B40F80LAAKXUMA1

This detailed comparison of XC2764X40F80LRABKXUMA1 and XC2364B40F80LAAKXUMA1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XC2764X40F80LRABKXUMA1

IR (Infineon Technologies)

Request For Quote

XC2364B40F80LAAKXUMA1

VIGOR

Request For Quote

Specifications Hide identical items

Manufacturer	IR (Infineon Technologies)	VIGOR
Package / Case	100-LQFP Exposed Pad	100-LQFP Exposed Pad
Description	IC MCU 16/32B 320KB FLSH 100LQFP	IC MCU 16/32B 320KB FLSH 100LQFP
In Stock	520	232
Mounting Type	Surface Mount	Surface Mount
Part Status	Not For New Designs	Obsolete
Series	XC27x4X	XC23xxB
Package	Tape & Reel (TR)	Bulk
Core Processor	C166SV2	C166SV2
Core Size	16/32-Bit	16/32-Bit
Speed	80MHz	80MHz
Connectivity	CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI	CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals	I²S, POR, PWM, WDT	I²S, POR, PWM, WDT
Number of I/O	76	76
Program Memory Size	320KB (320K x 8)	320KB (320K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	34K x 8	34K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V	3V ~ 5.5V
Data Converters	A/D 16x10b	A/D 16x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	PG-LQFP-100-8	PG-LQFP-100-8