XCV1000E-8BG560C vs XCV812E-8BG560C

This detailed comparison of XCV1000E-8BG560C and XCV812E-8BG560C in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XCV1000E-8BG560C

Xilinx

XCV812E-8BG560C

Xilinx

Specifications Hide identical items

Manufacturer	Xilinx	Xilinx
Package / Case	560-LBGA Exposed Pad, Metal	560-LBGA Exposed Pad, Metal
Description	IC FPGA 404 I/O 560MBGA	IC FPGA 404 I/O 560MBGA
In Stock	216	160
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	Virtex®-E	Virtex®-E EM
Package	Tray	Tray
Number of LABs/CLBs	6144	4704
Number of Logic Elements/Cells	27648	21168
Total RAM Bits	393216	1146880
Number of I/O	404	404
Number of Gates	1569178	254016
Voltage - Supply	1.71V ~ 1.89V	1.71V ~ 1.89V
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)
Supplier Device Package	560-MBGA (42.5x42.5)	560-MBGA (42.5x42.5)

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