XCV100E-6BG352I vs XCV100E-7BG352C

This detailed comparison of XCV100E-6BG352I and XCV100E-7BG352C in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XCV100E-6BG352I

XCV100E-6BG352I

Xilinx

XCV100E-7BG352C

XCV100E-7BG352C

Xilinx

Specifications
Manufacturer Xilinx Xilinx
Package / Case 352-LBGA Exposed Pad, Metal 352-LBGA Exposed Pad, Metal
Description IC FPGA 196 I/O 352MBGA IC FPGA 196 I/O 352MBGA
In Stock 860 657
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series Virtex®-E Virtex®-E
Package Tray Tray
Number of LABs/CLBs 600 600
Number of Logic Elements/Cells 2700 2700
Total RAM Bits 81920 81920
Number of I/O 196 196
Number of Gates 128236 128236
Voltage - Supply 1.71V ~ 1.89V 1.71V ~ 1.89V
Operating Temperature -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
Supplier Device Package 352-MBGA (35x35) 352-MBGA (35x35)
Part Number Manufacturer Description Request For Quote
5SGSMD3E3H29I4WN Intel IC FPGA STRATIX V GS FLIP CHIP
XC4006E-4PG156I Xilinx IC FPGA 125 I/O 156CPGA
5SGSED8N1F46I2G Intel IC FPGA STRATIX V GS 1932-FBGA
XCV600-5HQ240C Xilinx IC FPGA 166 I/O 240QFP
EP2S90F780C5G Intel IC FPGA 534 I/O 780FBGA
5AGXFB5H4F35I3NAA Intel IC FPGA ARRIA V GX FLIP CHIP
AGL400V2-FGG484 Microsemi IC FPGA 194 I/O 484FBGA
XCV200-5BG352I Xilinx IC FPGA 260 I/O 352MBGA
5SGSED8N2F46C2LNCV Intel IC FPGA STRATIX V GS FLIP CHIP
A54SX16P-PQ208I Roving Networks / Microchip Technology IC FPGA 175 I/O 208QFP
EP3SL340F1760C4NAA Intel IC FPGA STRATIX III FLIP CHIP
5AGTFD7K3F40I3N Intel IC FPGA 704 I/O 1517FBGA
MPF300XT-1FCG484I Microsemi IC FPGA 244 I/O 484FBGA
5SGXMA7K2F35I3NAA Intel IC FPGA STRATIX V GX FLIP CHIP
EP1C3XXB Intel IC FPGA
Top