XCV200E-8BG352C vs XCV300E-8BG352C

This detailed comparison of XCV200E-8BG352C and XCV300E-8BG352C in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XCV200E-8BG352C

Xilinx

XCV300E-8BG352C

Xilinx

Specifications Hide identical items

Manufacturer	Xilinx	Xilinx
Package / Case	352-LBGA Exposed Pad, Metal	352-LBGA Exposed Pad, Metal
Description	IC FPGA 260 I/O 352MBGA	IC FPGA 260 I/O 352MBGA
In Stock	325	422
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	Virtex®-E	Virtex®-E
Package	Tray	Tray
Number of LABs/CLBs	1176	1536
Number of Logic Elements/Cells	5292	6912
Total RAM Bits	114688	131072
Number of I/O	260	260
Number of Gates	306393	411955
Voltage - Supply	1.71V ~ 1.89V	1.71V ~ 1.89V
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)
Supplier Device Package	352-MBGA (35x35)	352-MBGA (35x35)

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