XCV300-5BG432I vs XCV300E-6BG432I

This detailed comparison of XCV300-5BG432I and XCV300E-6BG432I in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XCV300-5BG432I

Xilinx

XCV300E-6BG432I

Xilinx

Specifications Hide identical items

Manufacturer	Xilinx	Xilinx
Package / Case	432-LBGA Exposed Pad, Metal	432-LBGA Exposed Pad, Metal
Description	IC FPGA 316 I/O 432MBGA	IC FPGA 316 I/O 432MBGA
In Stock	339	840
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	Virtex®	Virtex®-E
Package	Tray	Tray
Number of LABs/CLBs	1536	1536
Number of Logic Elements/Cells	6912	6912
Total RAM Bits	65536	131072
Number of I/O	316	316
Number of Gates	322970	411955
Voltage - Supply	2.375V ~ 2.625V	1.71V ~ 1.89V
Operating Temperature	-40°C ~ 100°C (TJ)	-40°C ~ 100°C (TJ)
Supplier Device Package	432-MBGA (40x40)	432-MBGA (40x40)

Other Comparisons

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5SGXEA7K3F40C3WN	Intel	IC FPGA STRATIX V GX FLIP CHIP
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EP20K1500CB652C8ES	Intel	IC FPGA 488 I/O 652BGA
XCV100E-7BG352C	Xilinx	IC FPGA 196 I/O 352MBGA
XCV300E-7BG432I	Xilinx	IC FPGA 316 I/O 432MBGA