XE232-1024-FB374-I40 vs XEF232-1024-FB374-I40

This detailed comparison of XE232-1024-FB374-I40 and XEF232-1024-FB374-I40 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XE232-1024-FB374-I40

XMOS

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XEF232-1024-FB374-I40

XMOS

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Specifications Hide identical items

Manufacturer	XMOS	XMOS
Package / Case	374-LFBGA	374-LFBGA
Description	IC MCU 32BIT ROMLESS 374FBGA	IC MCU 32BIT 2MB FLASH 374FBGA
In Stock	6 352	8 000
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Not For New Designs
Series	XE	XEF
Package	Tray	Tray
Core Processor	XCore	XCore
Core Size	32-Bit 32-Core	32-Bit 32-Core
Speed	4000MIPS	4000MIPS
Connectivity	RGMII, USB	RGMII, USB
Peripherals	-	-
Number of I/O	176	176
Program Memory Size	-	2MB (2M x 8)
Program Memory Type	ROMless	FLASH
EEPROM Size	-	-
RAM Size	1M x 8	1M x 8
Voltage - Supply (Vcc/Vdd)	0.95V ~ 3.6V	0.95V ~ 3.6V
Data Converters	-	-
Oscillator Type	External	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	374-FBGA (18x18)	374-FBGA (18x18)