ZGP323HSP2016C vs ZGP323LSP2008G

This detailed comparison of ZGP323HSP2016C and ZGP323LSP2008G in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ZGP323HSP2016C

ZGP323HSP2016C

Zilog / Littelfuse

ZGP323LSP2008G

ZGP323LSP2008G

Zilog / Littelfuse

Specifications
Manufacturer Zilog / Littelfuse Zilog / Littelfuse
Package / Case 20-DIP (0.300", 7.62mm) 20-DIP (0.300", 7.62mm)
Description IC MCU 8BIT 16KB OTP 20DIP IC MCU 8BIT 8KB OTP 20DIP
In Stock 6 166 2 863
Mounting Type Through Hole Through Hole
Part Status Obsolete Obsolete
Series Z8® GP™ Z8® GP™
Package Tube Tube
Core Processor Z8 Z8
Core Size 8-Bit 8-Bit
Speed 8MHz 8MHz
Connectivity - -
Peripherals HLVD, POR, WDT HLVD, POR, WDT
Number of I/O 16 16
Program Memory Size 16KB (16K x 8) 8KB (8K x 8)
Program Memory Type OTP OTP
EEPROM Size - -
RAM Size 237 x 8 237 x 8
Voltage - Supply (Vcc/Vdd) 2V ~ 5.5V 2V ~ 3.6V
Data Converters - -
Oscillator Type Internal Internal
Operating Temperature 0°C ~ 70°C (TA) 0°C ~ 70°C (TA)
Supplier Device Package - -
Part Number Manufacturer Description Request For Quote
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