MC9S08SH4CPJ vs MC9S08SH8MPJ

This detailed comparison of MC9S08SH4CPJ and MC9S08SH8MPJ in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S08SH4CPJ

NXP Semiconductors

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MC9S08SH8MPJ

VIGOR

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	VIGOR
Package / Case	20-DIP (0.300", 7.62mm)	20-DIP (0.300", 7.62mm)
Description	IC MCU 8BIT 4KB FLASH 20DIP	IC MCU 8BIT 8KB FLASH 20DIP
In Stock	36	744
Mounting Type	Through Hole	Through Hole
Part Status	Active	Active
Series	S08	S08
Package	Tube	Bulk
Core Processor	S08	S08
Core Size	8-Bit	8-Bit
Speed	40MHz	40MHz
Connectivity	I²C, LINbus, SCI, SPI	I²C, LINbus, SCI, SPI
Peripherals	LVD, POR, PWM, WDT	LVD, POR, PWM, WDT
Number of I/O	17	17
Program Memory Size	4KB (4K x 8)	8KB (8K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	256 x 8	512 x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V	2.7V ~ 5.5V
Data Converters	A/D 12x10b	A/D 12x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	20-DIP	20-DIP