
| Type | Description |
|---|---|
| Series: | - |
| Package: | Jar |
| Part Status: | Active |
| Type: | Solder Paste, Two Part Mix |
| Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter: | - |
| Melting Point: | 423 ~ 428°F (217 ~ 220°C) |
| Flux Type: | No-Clean |
| Wire Gauge: | - |
| Process: | Lead Free |
| Form: | Jar, 2.12 oz (60g) |
| Shelf Life: | 24 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 37°F ~ 77°F (3°C ~ 25°C) |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 |
Current price of SMD291SNL60T4 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
LF SOLDER WIRE 99.3/0.7 TIN/COPP
SOLDER PASTE WATER SOLUBLE 750GM
SOLDER FLUX-CORED/245 63/37 .015
SN96.5/AG3.0/CU0.5 2-PRT MIX 60G
IC MCU 32BIT 48KB FLASH 48LQFP
IC MCU 8BIT 3.5KB OTP 20SSOP
CABLE MOD 8P8C PLUG-PLUG 22.97'