
| Type | Description |
|---|---|
| Series: | CHIPQUIK® |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Solder Paste |
| Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter: | - |
| Melting Point: | 423°F (217°C) |
| Flux Type: | No-Clean |
| Wire Gauge: | - |
| Process: | Leaded |
| Form: | Jar, 17.64 oz (500g) |
| Shelf Life: | 12 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 |
Current price of TS991SNL500T4 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
SLD PASTE LF WATER SOL T5 10CC
LF SOLDER WIRE MINI POCKET PACK
SOLDER FLUX-CORED/331 .024" 1LB
SOLDER PASTE THERMALLY STABLE NC
.050 X .050 C.L. FEMALE IDC ASSE
IC MPU I.MC6UL 528MHZ 289BGA
FIXED IND 5.6UH 220MA 1.1 OHM