
| Type | Description |
|---|---|
| Series: | 800 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 22 (2 x 11) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 25.0µin (0.63µm) |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin-Lead |
| Contact Finish Thickness - Post: | 80.0µin (2.03µm) |
| Contact Material - Post: | Copper Alloy |
| Housing Material: | Polyester |
| Operating Temperature: | -55°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 22 | ||
| 44 | ||
| 66 | ||
| 110 | ||
| 264 | ||
| 506 | ||
| 1012 | ||
| 2508 |
Current price of 822-AG11D is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 52POS GOLD
CONN SOCKET LGA 2011POS GOLD
CONN IC DIP SOCKET 16POS GOLD
CONN IC DIP SOCKET 22POS GOLD