
| Type | Description |
|---|---|
| Series: | Lo-PRO®file, 513 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.9" (22.86mm) Row Spacing |
| Number of Positions or Pins (Grid): | 10 (2 x 5) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 28 |
Current price of 10-9513-11 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 40POS GOLD
CONN IC DIP SOCKET ZIF 28POS TIN
CONN IC DIP SOCKET 6POS GOLD
CONN HEADER SMD 70POS 2.54MM
CONN IC DIP SOCKET 10POS GOLD
SLEEVING 0.258" ID FBRGLASS 100'
CONN HDR DIP POST 28POS GOLD