
| Type | Description |
|---|---|
| Series: | 116 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 20 (2 x 10) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Elevated, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 189 |
Current price of 116-83-320-41-011101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN TRANSIST TO-254 3POS GOLD
CONN IC DIP SOCKET 6POS GOLD
CONN IC DIP SOCKET 24POS TIN
CRYSTAL 16.0000MHZ 18PF SMD
CONN PLUG HSG MALE 35POS INLINE
CONN IC DIP SOCKET 20POS GOLD
RES ARRAY 4 RES 56 OHM 8SIP