
| Type | Description |
|---|---|
| Series: | 116 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 50 (2 x 25) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Elevated, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 112 |
Current price of 116-87-650-41-009101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
PLCC 52P THROUGH HOLE
CONN IC DIP SOCKET 28POS GOLD
CONN IC DIP SOCKET 64POS GOLD
MEMS OSC XO 98.3040MHZ LVPECL
CONN IC DIP SOCKET 50POS GOLD
DIODE ZENER 16V 500MW SOD123
SENSOR PROX INDUCTIVE