
| Type | Description |
|---|---|
| Series: | 500 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 32 (2 x 16) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 25.0µin (0.63µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 25.0µin (0.63µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyester |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 375 |
Current price of 6-1437532-1 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 32POS GOLD
CONN SOCKET SIP 25POS GOLD
CONN IC DIP SOCKET 22POS GOLD
FIXED IND 5.3UH 1.4A 150 MOHM
CRYSTAL 32.0000MHZ 10PF SMD
CONN IC DIP SOCKET 32POS GOLD
MEMS OSC XO 8.0000MHZ LVCMOS SMD