
| Type | Description |
|---|---|
| Series: | 500 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 8 (2 x 4) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 5.00µin (0.127µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 5.00µin (0.127µm) |
| Contact Material - Post: | Brass |
| Housing Material: | - |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 1200 |
Current price of 508-AG10D-ESL is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 28POS GOLD
CONN SOCKET QFN 40POS GOLD
CONN IC DIP SOCKET 18POS GOLD
RES 152 OHM 0.25% 1/10W 0603
XTAL OSC VCXO 100.0000MHZ LVDS
CONN IC DIP SOCKET 8POS GOLD
FUSE CLIP CART 250V 30A CHASSIS