
| Type | Description |
|---|---|
| Series: | 116 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.4" (10.16mm) Row Spacing |
| Number of Positions or Pins (Grid): | 32 (2 x 16) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Elevated, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 247 |
Current price of 116-87-432-41-003101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET ZIF 40POS TIN
CONN IC DIP SOCKET 18POS GOLD
CONN SOCKET PLCC 68POS TIN
CRYSTAL 24.3050MHZ 6PF SMD
CONN IC DIP SOCKET 22POS TINLEAD
CONN IC DIP SOCKET 32POS GOLD
MODJACK LOW/PROF RT< 8P8C SHIELD