| Type | Description |
|---|---|
| Series: | 714 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SIP |
| Number of Positions or Pins (Grid): | 36 (1 x 36) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Carrier |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Brass Alloy |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 | ||
| 250 | ||
| 500 |
Current price of 714-43-136-31-018000 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 40POS TIN
CONN IC DIP SOCKET 36POS GOLD
CONN IC DIP SOCKET 22POS GOLD
XTAL OSC TCXO 98.3040MHZ LVCMOS
XTAL OSC XO 100.0000MHZ LVDS
CONN SOCKET SIP 36POS GOLD
90 DEGREE ELBOW INTERN. ACCESS
