
| Type | Description |
|---|---|
| Series: | 100 |
| Package: | Bulk |
| Part Status: | Obsolete |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 14 (2 x 7) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 8.00µin (0.203µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame, Seal Tape |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | Flash |
| Contact Material - Post: | Brass |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | -65°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of 100-014-051 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET SIP 30POS GOLD
CONN SOCKET PGA ZIF 370POS GOLD
CONN SOCKET SIP 16POS GOLD
CONN HEADER VERT 4POS 5.03MM
IC REG BUCK ADJ 3.5A 10DFN
THRU HOLE 2.7X7.3MM, FAST 160MA
CONN IC DIP SOCKET 14POS GOLD