
| Type | Description |
|---|---|
| Series: | 100 |
| Package: | Bulk |
| Part Status: | Obsolete |
| Type: | DIP, 0.4" (10.16mm) Row Spacing |
| Number of Positions or Pins (Grid): | 24 (2 x 12) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 8.00µin (0.203µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | Flash |
| Contact Material - Post: | Brass |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | -65°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of 110-024-050 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 32POS GOLD
CONN IC DIP SOCKET 48POS TIN
CONN IC DIP SOCKET 6POS GOLD
RES SMD 453 OHM 1% 1/2W 1210
CAP CER 180PF 1.2KV C0G/NP0 2220
CAP CER 0805 150NF 63V X7R 20%
CONN IC DIP SOCKET 24POS GOLD