
| Type | Description |
|---|---|
| Series: | SIP1x |
| Package: | Bulk |
| Part Status: | Obsolete |
| Type: | SIP |
| Number of Positions or Pins (Grid): | 4 (1 x 4) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | 150.0µin (3.81µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of SIP1X04-014BLF is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET PGA ZIF 370POS GOLD
CONN IC DIP SOCKET 16POS GOLD
CONN SOCKET SIP 18POS TIN
CAP CER 6200PF 200V C0G/NP0 RAD
FIXED IND 3.3UH 7A 20 MOHM SMD
CONN SOCKET SIP 4POS TIN