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Type | Description |
---|---|
Series: | 630 |
Package: | Bulk |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Not Included) |
Shape: | Square, Pin Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | - |
Fin Height: | 0.450" (11.43mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 4.00°C/W @ 400 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Black Anodized |
RES SMD 95.3K OHM 0.1% 1/6W 0603
RES SMD 1.6M OHM 5% 1/3W 0805
CAP CER 4700PF 16V X7R 1206
HEATSINK FOR 35MM BGA