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Type | Description |
---|---|
Series: | Tflex™ 300 |
Package: | Bulk |
Part Status: | Active |
Usage: | - |
Type: | Gap Filler Pad, Sheet |
Shape: | Square |
Outline: | 228.60mm x 228.60mm |
Thickness: | 0.200" (5.08mm) |
Material: | Silicone Elastomer |
Adhesive: | - |
Backing, Carrier: | - |
Color: | Green |
Thermal Resistivity: | 2.11°C/W |
Thermal Conductivity: | 1.2W/m-K |
MEMS OSC XO 33.3333MHZ H/LV-CMOS
MEMS OSC XO 33.33333MHZ H/LVCMOS
CRYSTAL 12.0000MHZ 10PF SMD
THERM PAD 228.6MMX228.6MM GREEN