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Type | Description |
---|---|
Series: | CHO-BOND® 2165 |
Package: | Bulk |
Part Status: | Active |
Type: | EMI Conductive Sealant |
Shape: | - |
Length: | - |
Width: | - |
Thickness - Overall: | - |
Operating Temperature: | - |
Adhesive: | - |
Material: | Polyurethane |
SENSOR PRESSURE 1000PSIG ANALOG
BOARD EVALUATION SI5392
COPPER EMI SEALANT 1QT BRN/RED
OC-AT-S-FM-090F165O-001-0219