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Type | Description |
---|---|
Series: | - |
Package: | Spool |
Part Status: | Active |
Type: | Wire Solder |
Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter: | 0.020" (0.51mm) |
Melting Point: | 430°F (221°C) |
Flux Type: | No-Clean |
Wire Gauge: | 24 AWG, 25 SWG |
Process: | Lead Free |
Form: | Spool, 4 oz (113.40g) |
Shelf Life: | - |
Shelf Life Start: | - |
Storage/Refrigeration Temperature: | - |
RES 887 OHM 0.1% 1/16W 0402
FIXED IND 740NH 3.5A 14.3 MOHM
THERM PAD 16.51MMX16.51MM
LEAD FREE NO-CLEAN FLUX CORE SIL