ATSAM3S8CA-CU vs ATSAM3SD8CA-CU

This detailed comparison of ATSAM3S8CA-CU and ATSAM3SD8CA-CU in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAM3S8CA-CU

Roving Networks / Microchip Technology

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ATSAM3SD8CA-CU

VIGOR

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	VIGOR
Package / Case	100-TFBGA	100-TFBGA
Description	IC MCU 32BIT 512KB FLSH 100TFBGA	IC MCU 32BIT 512KB FLSH 100TFBGA
In Stock	92	81
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SAM3S	SAM3S
Package	Tray	Bulk
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	64MHz	64MHz
Connectivity	EBI/EMI, I²C, IrDA, Memory Card, SPI, SSC, UART/USART, USB	EBI/EMI, I²C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	79	79
Program Memory Size	512KB (512K x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	64K x 8	64K x 8
Voltage - Supply (Vcc/Vdd)	1.62V ~ 3.6V	1.62V ~ 3.6V
Data Converters	A/D 15x10/12b; D/A 2x12b	A/D 15x10/12b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-TFBGA (9x9)	100-TFBGA (9x9)