ATSAM3U2CA-CU vs ATSAM3U1CB-CU

This detailed comparison of ATSAM3U2CA-CU and ATSAM3U1CB-CU in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAM3U2CA-CU

Roving Networks / Microchip Technology

Request For Quote

ATSAM3U1CB-CU

Roving Networks / Microchip Technology

Request For Quote

Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	100-TFBGA	100-TFBGA
Description	IC MCU 32BIT 128KB FLSH 100TFBGA	IC MCU 32BIT 64KB FLASH 100TFBGA
In Stock	3 697	3 000
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SAM3U	SAM3U
Package	Tray	Tray
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	96MHz	96MHz
Connectivity	EBI/EMI, I²C, Memory Card, SPI, SSC, UART/USART, USB	EBI/EMI, I²C, Memory Card, SPI, SSC, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	57	57
Program Memory Size	128KB (128K x 8)	64KB (64K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	36K x 8	20K x 8
Voltage - Supply (Vcc/Vdd)	1.62V ~ 3.6V	1.62V ~ 3.6V
Data Converters	A/D 4x10b, 4x12b	A/D 4x10b, 4x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-TFBGA (9x9)	100-TFBGA (9x9)