BR25H160FJ-2CE2 vs BR25H640FJ-2CE2

This detailed comparison of BR25H160FJ-2CE2 and BR25H640FJ-2CE2 in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

BR25H160FJ-2CE2

ROHM Semiconductor

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BR25H640FJ-2CE2

ROHM Semiconductor

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Specifications Hide identical items

Manufacturer	ROHM Semiconductor	ROHM Semiconductor
Package / Case	8-SOIC (0.154", 3.90mm Width)	8-SOIC (0.154", 3.90mm Width)
Description	IC EEPROM 16KBIT SPI 10MHZ 8SOPJ	IC EEPROM 64KBIT SPI 10MHZ 8SOPJ
In Stock	2 296	2 500
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	Automotive, AEC-Q100	Automotive, AEC-Q100
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Memory Type	Non-Volatile	Non-Volatile
Memory Format	EEPROM	EEPROM
Technology	EEPROM	EEPROM
Memory Size	16Kb (2K x 8)	64Kb (8K x 8)
Memory Interface	SPI	SPI
Clock Frequency	10 MHz	10 MHz
Write Cycle Time - Word, Page	4ms	4ms
Access Time	-	-
Voltage - Supply	2.5V ~ 5.5V	2.5V ~ 5.5V
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	8-SOP-J	8-SOP-J