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D13008FBL25V vs D13008VFBL25V

This detailed comparison of D13008FBL25V and D13008VFBL25V in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

D13008FBL25V

D13008FBL25V

Renesas Electronics America

D13008VFBL25V

D13008VFBL25V

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 100-BFQFP 100-BFQFP
Description IC MCU 16BIT ROMLESS 100QFP IC MCU 16BIT ROMLESS 100QFP
In Stock 2 000 4 000
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series H8® H8/300H H8® H8/300H
Package Tray Tray
Core Processor H8/300H H8/300H
Core Size 16-Bit 16-Bit
Speed 25MHz 25MHz
Connectivity SCI, SmartCard SCI, SmartCard
Peripherals PWM, WDT PWM, WDT
Number of I/O 35 35
Program Memory Size - -
Program Memory Type ROMless ROMless
EEPROM Size - -
RAM Size 4K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 3V ~ 3.6V
Data Converters A/D 8x10b; D/A 2x8b A/D 8x10b; D/A 2x8b
Oscillator Type Internal Internal
Operating Temperature -20°C ~ 75°C (TA) -20°C ~ 75°C (TA)
Supplier Device Package 100-QFP (14x14) 100-QFP (14x14)
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