DF38776H10V vs DF38776H10WV

This detailed comparison of DF38776H10V and DF38776H10WV in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DF38776H10V

DF38776H10V

Renesas Electronics America

DF38776H10WV

DF38776H10WV

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 80-BQFP 80-BQFP
Description IC MCU 32BIT 52KB FLASH 80QFP IC MCU 32BIT 52KB FLASH 80QFP
In Stock 558 334
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series H8® H8/300H SLP H8® H8/300H SLP
Package Tray Tray
Core Processor H8/300H H8/300H
Core Size 32-Bit 32-Bit
Speed 10MHz 10MHz
Connectivity I²C, IrDA, SCI, UART/USART I²C, IrDA, SCI, UART/USART
Peripherals DMA, PWM, WDT DMA, PWM, WDT
Number of I/O 55 55
Program Memory Size 52KB (52K x 8) 52KB (52K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 2K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -20°C ~ 75°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 80-QFP (14x14) 80-QFP (14x14)
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