DSPIC33EP256MU810-E/BG vs DSPIC33EP256MU810-I/BG

This detailed comparison of DSPIC33EP256MU810-E/BG and DSPIC33EP256MU810-I/BG in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33EP256MU810-E/BG

Roving Networks / Microchip Technology

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DSPIC33EP256MU810-I/BG

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	121-TFBGA	121-TFBGA
Description	IC MCU 16BIT 256KB FLSH 121TFBGA	IC MCU 16BIT 256KB FLSH 121TFBGA
In Stock	910	892
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	Automotive, AEC-Q100, dsPIC™ 33EP	dsPIC™ 33EP
Package	Tray	Tray
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	60 MIPs	60 MIPs
Connectivity	CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG	CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals	Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT	Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O	83	83
Program Memory Size	256KB (85.5K x 24)	256KB (85.5K x 24)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	12K x 16	12K x 16
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 32x10b/12b	A/D 32x10b/12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	121-TFBGA (10x10)	121-TFBGA (10x10)