MK60DN512ZVMD10 vs MK60DN512VMD10

This detailed comparison of MK60DN512ZVMD10 and MK60DN512VMD10 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MK60DN512ZVMD10

MK60DN512ZVMD10

NXP Semiconductors

MK60DN512VMD10

MK60DN512VMD10

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 144-LBGA 144-LBGA
Description IC MCU 32B 512KB FLASH 144MAPBGA IC MCU 32B 512KB FLASH 144MAPBGA
In Stock 6 000 200
Mounting Type Surface Mount Surface Mount
Part Status Not For New Designs Active
Series Kinetis K60 Kinetis K60
Package Tray Tray
Core Processor ARM® Cortex®-M4 ARM® Cortex®-M4
Core Size 32-Bit 32-Bit
Speed 100MHz 100MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals DMA, I²S, LVD, POR, PWM, WDT DMA, I²S, LVD, POR, PWM, WDT
Number of I/O 100 100
Program Memory Size 512KB (512K x 8) 512KB (512K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 128K x 8 128K x 8
Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V 1.71V ~ 3.6V
Data Converters A/D 42x16b; D/A 2x12b A/D 42x16b; D/A 2x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Supplier Device Package 144-MAPBGA (13x13) 144-MAPBGA (13x13)
Part Number Manufacturer Description Request For Quote
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