R5F52318BDND#U0 vs R5F52317BDND#U0

This detailed comparison of R5F52318BDND#U0 and R5F52317BDND#U0 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R5F52318BDND#U0

R5F52318BDND#U0

Renesas Electronics America

R5F52317BDND#U0

R5F52317BDND#U0

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 64-WFQFN Exposed Pad 64-WFQFN Exposed Pad
Description IC MCU 32BIT 512KB FLASH 64HWQFN IC MCU 32BIT 384KB FLASH 64HWQFN
In Stock 50 3 817
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series RX200 RX200
Package Tray Tray
Core Processor RXv2 RXv2
Core Size 32-Bit 32-Bit
Speed 54MHz 54MHz
Connectivity CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 43 43
Program Memory Size 512KB (512K x 8) 384KB (384K x 8)
Program Memory Type FLASH FLASH
EEPROM Size 8K x 8 8K x 8
RAM Size 64K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V 1.8V ~ 5.5V
Data Converters A/D 12x12b; D/A 2x12b A/D 12x12b; D/A 2x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 64-HWQFN (9x9) 64-HWQFN (9x9)
Part Number Manufacturer Description Request For Quote
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