R5F52317BDND#U0 vs R5F52316ADND#U0

This detailed comparison of R5F52317BDND#U0 and R5F52316ADND#U0 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R5F52317BDND#U0

Renesas Electronics America

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R5F52316ADND#U0

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	64-WFQFN Exposed Pad	64-WFQFN Exposed Pad
Description	IC MCU 32BIT 384KB FLASH 64HWQFN	IC MCU 32BIT 256KB FLASH 64HWQFN
In Stock	3 817	50
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	RX200	RX200
Package	Tray	Tray
Core Processor	RXv2	RXv2
Core Size	32-Bit	32-Bit
Speed	54MHz	54MHz
Connectivity	CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG	CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals	DMA, LVD, POR, PWM, WDT	DMA, LVD, POR, PWM, WDT
Number of I/O	43	43
Program Memory Size	384KB (384K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	8K x 8	8K x 8
RAM Size	64K x 8	32K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 5.5V	1.8V ~ 5.5V
Data Converters	A/D 12x12b; D/A 2x12b	A/D 12x12b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	64-HWQFN (9x9)	64-HWQFN (9x9)