SPC5517GAVMG80 vs SPC5517EAMMG66

This detailed comparison of SPC5517GAVMG80 and SPC5517EAMMG66 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

SPC5517GAVMG80

SPC5517GAVMG80

NXP Semiconductors

SPC5517EAMMG66

SPC5517EAMMG66

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 208-BGA 208-BGA
Description IC MCU 32B 1.5MB FLASH 208MAPBGA IC MCU 32B 1.5MB FLASH 208MAPBGA
In Stock 4 000 1 908
Mounting Type Surface Mount Surface Mount
Part Status Active Obsolete
Series MPC55xx Qorivva MPC55xx Qorivva
Package Tray Tray
Core Processor e200z0, e200z1 e200z0, e200z1
Core Size 32-Bit Dual-Core 32-Bit Dual-Core
Speed 80MHz 66MHz
Connectivity CANbus, EBI/EMI, I²C, SCI, SPI CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 144 144
Program Memory Size 1.5MB (1.5M x 8) 1.5MB (1.5M x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 80K x 8 80K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.25V 4.5V ~ 5.25V
Data Converters A/D 40x12b A/D 40x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 208-MAPBGA (17x17) 208-MAPBGA (17x17)
Part Number Manufacturer Description Request For Quote
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