W25Q256JVCIM vs W25Q32JVTBIQ

This detailed comparison of W25Q256JVCIM and W25Q32JVTBIQ in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

W25Q256JVCIM

Winbond Electronics Corporation

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W25Q32JVTBIQ

Winbond Electronics Corporation

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Specifications Hide identical items

Manufacturer	Winbond Electronics Corporation	Winbond Electronics Corporation
Package / Case	24-TBGA	24-TBGA
Description	IC FLSH 256MBIT SPI/QUAD 24TFBGA	IC FLASH 32MBIT SPI/QUAD 24TFBGA
In Stock	4 000	7 552
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SpiFlash®	SpiFlash®
Package	Tray	Tray
Memory Type	Non-Volatile	Non-Volatile
Memory Format	FLASH	FLASH
Technology	FLASH - NOR	FLASH - NOR
Memory Size	256Mb (32M x 8)	32Mb (4M x 8)
Memory Interface	SPI - Quad I/O	SPI - Quad I/O
Clock Frequency	133 MHz	133 MHz
Write Cycle Time - Word, Page	3ms	3ms
Access Time	-	-
Voltage - Supply	2.7V ~ 3.6V	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	24-TFBGA (6x8)	24-TFBGA (6x8)