W25Q64JWXGIM TR vs W25Q64JWXGIQ TR

This detailed comparison of W25Q64JWXGIM TR and W25Q64JWXGIQ TR in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

W25Q64JWXGIM TR

Winbond Electronics Corporation

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W25Q64JWXGIQ TR

Winbond Electronics Corporation

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Specifications Hide identical items

Manufacturer	Winbond Electronics Corporation	Winbond Electronics Corporation
Package / Case	8-XDFN Exposed Pad	8-XDFN Exposed Pad
Description	IC FLASH 64MBIT SPI/QUAD 8XSON	IC FLASH 64MBIT SPI/QUAD 8XSON
In Stock	4 850	4 000
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SpiFlash®	SpiFlash®
Package	Tape & Reel (TR)	Tape & Reel (TR)
Memory Type	Non-Volatile	Non-Volatile
Memory Format	FLASH	FLASH
Technology	FLASH - NOR	FLASH - NOR
Memory Size	64Mb (8M x 8)	64Mb (8M x 8)
Memory Interface	SPI - Quad I/O	SPI - Quad I/O
Clock Frequency	133 MHz	133 MHz
Write Cycle Time - Word, Page	3ms	3ms
Access Time	-	-
Voltage - Supply	1.7V ~ 1.95V	1.7V ~ 1.95V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	8-XSON (4x4)	8-XSON (4x4)